This custom 2-layer rigid high-frequency PCB utilizes aerospace-grade TFA294 glass-free ceramic PTFE composite dielectric substrate. Engineered for ultra-stable, low-loss microwave and millimeter-wave applications, the board features immersion gold surface finishing with a fully solder mask-free and silkscreen-free double-sided structure. Every unit undergoes 100% electrical testing prior to shipment, ensuring superior consistency and long-term reliability for high-end RF and aerospace electronic systems.
PCB Specifications
| Parameter Item | Specification |
| Base Material | TFA294 glass-free ceramic PTFE composite substrate |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 97.53mm × 100.28mm (1 piece), tolerance: ±0.15mm |
| Minimum Trace / Space | 4 mils / 6 mils |
| Minimum Mechanical Hole Size | 0.35mm |
| Via Type | Only through-hole vias, no blind vias |
| Finished Board Thickness | 1.1mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Silkscreen Layer | Silkscreen-free on both top and bottom sides |
| Solder Mask Layer | Fully solder mask-free on both sides |
| Quality Test | 100% electrical testing implemented prior to shipment |
PCB Layer Stack-up Structure
| Layer Name | Specification |
| Copper Layer 1 (Top) | 35μm finished copper thickness |
| Dielectric Core | TFA294 ceramic PTFE substrate, 1.016mm (40mil) thickness |
| Copper Layer 2 (Bottom) | 35μm finished copper thickness |
Artwork & Quality Standards
Artwork Format: Fabricated with standard Gerber RS-274-X files to ensure precise circuit patterning and full manufacturing compatibility.
Quality Standard: All fabrication and inspection processes comply rigorously with IPC-Class-2 reliability specifications for stable performance and long-term structural durability.
Service Coverage: support global delivery and reliable product supply for international high-frequency PCB projects.
TFA Series Material Overview
The TFA series represents advanced glass-free PTFE ceramic composite dielectric substrates, adopting innovative nano-ceramic mixing and specialized lamination processes instead of traditional glass fiber impregnation manufacturing. Eliminating the fiberglass effect during electromagnetic wave propagation, this material minimizes X/Y/Z-axis anisotropy and delivers ultra-uniform electrical, thermal and mechanical properties. It features excellent frequency stability, ultra-low dielectric loss and copper-matched thermal expansion performance. Available with four customizable dielectric constants (2.94, 3.0, 6.15, 10.2), the TFA series serves as high-reliability, aerospace-grade alternatives to imported high-frequency substrates.
TFA294 Core Features & Benefits
Stable Dielectric Performance: Delivers a stable DK of 2.94 at 10GHz and ultra-low DF of 0.0010 (10/20GHz) / 0.0012 (40GHz), enabling low-loss broadband and millimeter-wave signal transmission.
Ultra-Low TCDK: Maintains a minimal TCDK of -5 ppm/°C across -55°C to 150°C, guaranteeing steady dielectric properties under extreme temperature variations.
Balanced Low CTE: Features matched CTE values (18 ppm/°C X/Y, 32 ppm/°C Z-axis) in the range of -55°C to 288°C, mitigating thermal stress and enhancing PTH structural reliability.
Efficient Thermal Dissipation: With 0.59 W/mk thermal conductivity, it rapidly dissipates operational heat and prevents performance degradation under continuous high-power working conditions.
Low Moisture Sensitivity: Ultra-low 0.03% moisture absorption prevents electrical parameter drift in humid environments, ensuring long-term stable circuit operation.
Typical Application Scenarios
Leveraging glass-free structure, ultra-low loss, extreme temperature stability and minimal anisotropy, TFA294 PCBs are ideal for high-precision and phase-sensitive high-frequency systems in aerospace, military and satellite communication fields:
- Aerospace and airborne equipment, aircraft in-cabin electronic systems
- High-precision microwave circuits and phase-sensitive antenna systems
- Early warning radars and airborne radar devices
- Phased array antennas and beamforming networks
- Satellite communication and navigation systems
- High-frequency power amplifier modules
Product Tags:
|
|
2-layer TFA294 PCB Low-loss Microwave Circuits with Immersion Gold Images
|
