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0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold

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0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold

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Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : TMM3

PCB size : 51mm x 25 mm=1PCS, +/- 0.15mm

Copper weight : 1OZ

Surface finish : Immersion Gold

Layer count : 2 layers

PCB Thickness : 0.6mm

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Introducing our latest shipment of PCBs based on TMM3: the ultimate solution for high-reliability strip-line and micro-strip applications. The Rogers TMM3 thermoset microwave material combines the best features of ceramic and traditional PTFE microwave circuit laminates, all without the need for specialized production techniques. With TMM3 laminates, you can enjoy the benefits of exceptional performance and reliability while avoiding pad lifting or substrate deformation during wire-bonding.

The TMM3 substrates offer exceptional performance and reliability. With a dielectric constant (Dk) of 3.27 +/- .032 at 10GHz and a dissipation factor as low as .0020 at 10GHz, these PCBs ensure consistent signal performance and excellent signal integrity. They also feature a thermal coefficient of Dk of 37 ppm/°K for stability across temperature variations and a high decomposition temperature (Td) of 425°C TGA for thermal stability. Additionally, the PCBs have a copper-matched coefficient of thermal expansion and a thermal conductivity of 0.7W/mk for enhanced reliability and efficient heat dissipation. Available in a thickness range of .0015 to .500 inches (+/- .0015”), these PCBs provide versatility to meet various design requirements.

Property TMM3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.27±0.032 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 3.45 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +37 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 109 - Mohm.cm - ASTM D257
Surface Resistivity >9x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 441 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 15 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 15 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 23 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 16.53 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.72 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.12
Specific Gravity 1.78 - - A ASTM D792
Specific Heat Capacity 0.87 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

Benefits:

1. Mechanical properties resist creep and cold flow, ensuring long-term stability.
2. Resistant to process chemicals, reducing damage during fabrication.
3. No sodium napthanate treatment required prior to electroless plating.
4. Reliable wire-bonding due to the thermoset resin base.

This PCB has specifications supplied to meet diverse needs. It's a 2-layer rigid PCBs with a copper layer thickness of 35 μm on each side. The Rogers TMM3 Core has a thickness of 0.508 mm (20mil), providing structural integrity. These PCBs come in a compact size of 51mm x 25mm (1PCS), with a tolerance of +/- 0.15mm. They offer a minimum Trace/Space of 4/7 mils, allowing for precise circuit design, and a minimum Hole Size of 0.4mm to accommodate various component placements. With a finished board thickness of 0.6mm, a finished Cu weight of 1oz (1.4 mils) on outer layers, and a via plating thickness of 20 μm, these PCBs are optimized for reliable interconnection and optimal conductivity. They feature an immersion gold surface finish, green solder mask on both top and bottom layers, and undergo a 100% electrical test prior to shipment to ensure their quality.

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM3
Dielectric constant: 3.27
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold

PCB Statistics:

Supports 15 components.
Total of 26 pads: 17 through-hole pads, 9 top SMT pads.
12 vias and 2 nets for efficient interconnection.
Quality and Availability:

IPC-Class-2 quality standard.
Compatible with Gerber RS-274-X artwork.
Available worldwide for easy access.

Typical Applications:

RF and microwave circuitry.
Power amplifiers and combiners.
Filters and couplers.
Satellite communication systems.
Global Positioning Systems (GPS) Antennas.
Patch Antennas.
Dielectric polarizers and lenses.
Chip testers.

Experience exceptional performance, reliability, and versatility with our TMM3-based PCBs. Contact us today to elevate your RF, microwave, and power applications.

0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold


Product Tags:

Green Soldermask PCB

      

20mil Dual Layer PCB

      

0.6mm TMM3 PCB

      
Quality 0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold for sale

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