Today, the feature is our newly shipped PCB which based on TMM4 substrates. TMM4 is a state-of-the-art thermoset microwave material designed specifically for high plated-through-hole reliability strip-line and microstrip applications. This ceramic, hydrocarbon, thermoset polymer composite combines the mechanical and chemical advantages of ceramic and traditional PTFE laminates while eliminating the need for specialized production techniques.
Featuring a dielectric constant (Dk) of 4.50 +/- .045 and a dissipation factor of .0020 at 10GHz, TMM4 provides excellent electrical performance for RF and microwave circuitry. Its thermal coefficient of Dk of 15ppm/°K ensures stability over a wide range of temperatures, while the coefficient of thermal expansion matched to copper guarantees dimensional integrity. TMM4 exhibits a decomposition temperature (Td) of 425 °C TGA, making it exceptionally resistant to heat. With a thermal conductivity of 0.7 W/mk, it efficiently dissipates heat, contributing to the overall reliability of the system.
| TMM4 Typical Value |
| Property | TMM4 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 4.5±0.045 | Z | | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign | 4.7 | - | - | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of dielectric constant | +15 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 |
| Volume Resistivity | 6 x 108 | - | Mohm.cm | - | ASTM D257 |
| Surface Resistivity | 1 x 109 | - | Mohm | - | ASTM D257 |
| Electrical Strength(dielectric strength) | 371 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 |
| Thermal Properties |
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 |
| Coefficient of Thermal Expansion - x | 16 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Y | 16 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Z | 21 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80 ℃ | ASTM C518 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 |
| Flexural Strength (MD/CMD) | 15.91 | X,Y | kpsi | A | ASTM D790 |
| Flexural Modulus (MD/CMD) | 1.76 | X,Y | Mpsi | A | ASTM D790 |
| Physical Properties |
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.07 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.18 |
| Specific Gravity | 2.07 | - | - | A | ASTM D792 |
| Specific Heat Capacity | 0.83 | - | J/g/K | A | Calculated |
| Lead-Free Process Compatible | YES | - | - | - | - |
TMM4's mechanical properties resist creep and cold flow, ensuring long-term performance and reliability. It is also highly resistant to process chemicals, minimizing damage during fabrication. The use of a thermoset resin in its composition allows for reliable wire-bonding without the risk of pad lifting or substrate deformation. TMM4 is compatible with all common PWB processes, making it versatile and easy to integrate into existing manufacturing workflows.
This PCB is a 2-layer rigid board with a copper weight of 35 μm on each outer layer. The board dimensions are a circle with a diameter of 83mm, with a finished thickness of 0.8mm. The minimum trace/space is 6/8 mils, and the minimum hole size is 0.35mm. It undergoes a thorough 100% electrical test prior to shipment, ensuring its quality and reliability.
| PCB Material: | Composite of Ceramic, hydrocarbon and thermoset polymer |
| Designator: | TMM4 |
| Dielectric constant: | 4.5 ±0.045 (process); 4.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP. |
TMM4 PCBs find applications in a wide range of industries. They are particularly suitable for RF and microwave circuitry, power amplifiers, combiners, filters, couplers, satellite communication systems, global positioning systems antennas, patch antennas, dielectric polarizers and lenses, and chip testers. With its outstanding electrical performance, mechanical reliability, and compatibility with standard PWB processes, TMM4 PCBs deliver exceptional performance and durability.
This PCB based on TMM4 adhere to the IPC-Class-2 quality standard and are available worldwide. The supplied artwork is in Gerber RS-274-X format, ensuring compatibility with standard PCB manufacturing processes.
With its exceptional electrical performance, mechanical reliability, and compatibility with standard PWB processes, TMM4 PCBs offer a reliable and high-quality solution for demanding RF and microwave applications. With worldwide availability and support, TMM4 PCBs empower engineers and designers to unleash their creativity and push the boundaries of what's possible in the world of RF and microwave circuitry.
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25mil TMM4 2-layer Immersion Gold High Frequency PCB Green Solder Mask Images
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