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5mil RF-35TC PCB Double-sided 1OZ Circuit Board

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5mil RF-35TC PCB Double-sided 1OZ Circuit Board

Name: 5mil RF35TC PCB Doublesided 1OZ Circuit Board
Brand: Bicheng
Price: 9.99 USD

Quality 5mil RF-35TC PCB Double-sided 1OZ Circuit Board for sale

Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : RF-35TC

PCB size : 48.17 mm x 47.7 mm=3PCS = 3 Types, +/- 0.15mm

Copper weight : 1oz (1.4 mils)

Surface finish : Immersion gold

Layer count : 2-layer

PCB Thickness : 0.2mm

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Introduction:
The RF-35TC PCB is a cutting-edge high-frequency material that offers best-in-class low dissipation factor and exceptional thermal conductivity. Designed for demanding high-power RF and microwave applications, this PTFE-based, ceramic-filled fiberglass substrate provides unparalleled performance where minimizing signal loss and efficiently dissipating heat are critical.

Features:

Thermally conductive low loss laminate with a dielectric constant of 3.5 ± 0.05 at 10 GHz/23°C
Ultra-low dissipation factor of 0.002 at 10 GHz/23°C
Impressive thermal conductivity of 0.87 W/m/K for 0.5 oz copper, 0.92 W/m/K for 1 oz copper
Excellent dimensional stability with low CTE of 11 ppm/°C (X-axis), 13 ppm/°C (Y-axis), 34 ppm/°C (Z-axis)
High thermal reliability with 5% weight loss temperature of 436°C
Low moisture absorption of only 0.05%

RF-35TC TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK @10 GHz	IPC-650 2.5.5.5.1(modified)		3.5		3.5
Tck(-30 to 120℃)	IPC-650 2.5.5.5.1(modified)	ppm	24	ppm	24
Df @10 GHz	IPC-650 2.5.5.5.1(modified)		0.0011		0.0011
Dielectric Breakdown	IPC-650 2.5.6(in-Plane,Two Pins in Oil)	kV	56.7	kV	56.7
Dielectric Strength	ASTM D 149(Through Plane)	V/mil	570	V/mm	22,441
Arc Resistance	IPC-650 2.5.1	Seconds	304	Seconds	304
Moisture Absorption	IPC-650 2.6.2.1	%	0.05	%	0.05
Flexural Strength(MD)	ASTM D 790/IPC-650 2.4.4	psi	12,900	N/mm²	88.94
Flexural Strength(CD)	ASTM D 790/IPC-650 2.4.4	psi	11,700	N/mm²	80.67
Tensile Strength(MD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	9,020	N/mm²	62.19
Tensile Strength(CD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	7,740	N/mm²	53.37
Elongation at Break(MD)	ASTM D 3039/IPC-TM-650 2.4.19	%	1.89	N/mm	1.89
Elongation at Break(CD)	ASTM D 3039/IPC-TM-650 2.4.19	%	1.7	%	1.7
Young's Modulus(MD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	667,000	N/mm²	4,599
Young's Modulus(CD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	637,000	N/mm²	4,392
Poisson's Ratio(MD)	ASTM D 3039/IPC-TM-650 2.4.19		0.18		0.18
Poisson's Ratio(CD)	ASTM D 3039/IPC-TM-650 2.4.19		0.23		0.18
Compressive Modulus	ASTM D 695(23℃)	psi	560,000	N/mm²	3,861
Flexural Strength(MD)	ASTM D 790/IPC-650 2.4.4	psi	1.46 x 10⁶	N/mm²	10,309
Flexural Strength(CD)	ASTM D 790/IPC-650 2.4.4	psi	1.50 x 10⁶	N/mm²	10,076
Peel Stength(½ oz.CVH)	IPC-650 2.4.8(Thermal Stress.)	Ibs./inch	7	g/cm³	1.25
Thermal Conductivity(Unclad,125℃)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.6	W/(mK)	0.6
Thermal Conductivity(C1/C1,125℃)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.92	W/(mK)	0.92
Thermal Conductivity(CH/CH,125℃)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.87	W/(mK)	0.87
Dimensional Stability(MD)	IPC-650-2.4.39 Sec.5.4(After Etch)	mils/in.	0.23	mm/M	0.23
Dimensional Stability(CD)	IPC-650-2.4.39 Sec.5.4(After Etch)	mils/in.	0.64	mm/M	0.64
Dimensional Stability(MD)	IPC-650-2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	-0.04	mm/M	-0.04
Dimensional Stability(CD)	IPC-650-2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.46	mm/M	0.46
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	8.33 x 10⁷	Mohms	8.33 x 10⁷
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	6.42 x 10⁷	Mohms	6.42 x 10⁷
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	5.19 x 10⁸	Mohms/cm	5.19 x 10⁸
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	2.91 x 10⁸	Mohms/cm	2.91 x 10⁸
CTE(X axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	11	ppm/℃	11
CTE(Y axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	13	ppm/℃	13
CTE(Z axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	34	ppm/℃	34
Density	ASTM D 792	g/cm3	2.35	g/cm3	2.35
Hardness	ASTM D 2240(Shore D)		79.1		79.1
Strain at Break(MD)	ASTM D 790/IPC-650 2.4.4	%	0.014	%	0.014
Strain at Break(CD)	ASTM D 790/IPC-650 2.4.4	%	0.013	%	0.013
Specific Heat	ASTM E 1269-05,E 967-08,E968-02	j/(g℃)	0.94	j/(g℃)	0.94
Td(2% Weight Loss)	IPC-650 2.4.24.6/TGA	oF	788	℃	420
Td(5% Weight Loss)	IPC-650 2.4.24.6/TGA	oF	817	℃	436

Benefits:

"Best in class" loss tangent for maximum efficiency and signal integrity
Exceptional thermal management to dissipate heat from high-power components
Stable dielectric properties across a wide temperature range
Enhanced antenna gains and radiation efficiencies
Robust adhesion to very thin copper foils for high-density PCB designs

5mil RF-35TC PCB Double-sided 1OZ Circuit Board

This 2-layer rigid PCB features a 0.127 mm (5 mil) RF-35TC core with 35 μm copper layers and is constructed to the highest quality standards. With its industry-leading performance, the RF-35TC is the premier choice for demanding RF and microwave designs.

Applications:
The RF-35TC PCB is ideal for a wide range of high-frequency, high-power applications, including:

Filters, couplers, and power amplifiers
Antennas and satellite communications
Radar and sensing systems
Test and measurement equipment

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5mil RF-35TC PCB Double-sided 1OZ Circuit Board

5mil RF-35TC PCB Double-sided 1OZ Circuit Board

1OZ RF-35TC PCB

5mil RF-35TC PCB

Double-sided RF-35TC PCB

5mil RF-35TC PCB Double-sided 1OZ Circuit Board Images