Sign In | Join Free | My ledscreensign.com
China Bicheng Electronics Technology Co., Ltd logo
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Verified Supplier

5 Years

Home > RF PCB Board >

60mil TLX-8 PCB 2 Layer Immersion Gold Rigid Circuits

Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

60mil TLX-8 PCB 2 Layer Immersion Gold Rigid Circuits

  • 1
  • 2
  • 3

Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : TLX-8

PCB size : 108.72mm x 59.59 mm=1PCS, +/- 0.15mm

Copper weight : 1oz (1.4 mils)

Surface finish : Immersion Gold

Layer count : 2-layer

PCB Thickness : 1.6mm

Contact Now

The TLX-8 is a PTFE fiberglass laminate material designed for reliable performance in a wide range of RF applications. Its versatility comes from the availability of various thicknesses and copper cladding options. This material is well-suited for low-layer-count microwave designs, offering mechanical reinforcement for use in severe environments such as:

- High-vibration conditions during space launch
- High-temperature exposure in engine modules
- Radiation-rich environments in space
- Extreme marine conditions for warship antennas
- Wide temperature ranges for altimeter substrates

Key Benefits
- Excellent PIM (Passive Intermodulation) performance, measured at less than -160 dBc
- Excellent mechanical and thermal properties
- Low and stable dielectric constant (Dk)
- Dimensionally stable with low moisture absorption
- Tightly controlled Dk
- Low dissipation factor (Df)
- UL 94 V0 flammability rating
- Suitable for low-layer-count microwave designs

TLX-8 TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.3 2.55 2.55
Df @1.9 GHz IPC-650 2.5.5.5.1 0.0012 0.0012
Df @10 GHz IPC-650 2.5.5.5.1 0.0017 0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2
Poisson's Ratio ASTM D 3039 0.135 N/mm
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 21 ppm/ 21
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 23 ppm/ 23
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 215 ppm/ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) 535
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) 553
Flammability Rating UL-94 V-0 V-0

Technical Specifications

Electrical Properties
- Dielectric Constant @ 10 GHz: 2.55 ± 0.04
- Dissipation Factor @ 10 GHz: 0.0018
- Surface Resistivity (Elevated Temp.): 6.605 x 10^8 Mohm
- Surface Resistivity (Humidity Cond.): 3.550 x 10^6 Mohm
- Volume Resistivity (Elevated Temp.): 1.110 x 10^10 Mohm/cm
- Volume Resistivity (Humidity Cond.): 1.046 x 10^10 Mohm/cm

Dimensional Stability
- MD After Bake: 0.06 mm/M (mils/in)
- CD After Bake: 0.08 mm/M (mils/in)
- MD Thermal Stress: 0.09 mm/M (mils/in)
- CD Thermal Stress: 0.10 mm/M (mils/in)

CTE (25-260 °C)
- X: 21 ppm/°C
- Y: 23 ppm/°C
- Z: 215 ppm/°C

Thermal Properties
- 2% Weight Loss: 535 °C
- 5% Weight Loss: 553 °C

Chemical/Physical Properties
- Moisture Absorption: 0.02%
- Dielectric Breakdown: > 45 kV
- Flammability Rating: V-0 (UL-94)

60mil TLX-8 PCB 2 Layer Immersion Gold Rigid Circuits

PCB Construction
- 2-layer rigid PCB
- Copper layer 1: 35 μm
- Taconic TLX-8 Core: 1.524 mm (60 mil)
- Copper layer 2: 35 μm
- Board dimensions: 108.72 mm x 59.59 mm ± 0.15 mm
- Minimum trace/space: 5/5 mils
- Minimum hole size: 0.3 mm
- Finished board thickness: 1.6 mm
- Finished copper weight: 1 oz (1.4 mils) on outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion gold
- Top silkscreen: White
- Bottom silkscreen: None
- Top solder mask: None
- Bottom solder mask: None
- 100% electrical test prior to shipment

Availability
Worldwide

Typical Applications
- Radar systems
- Mobile communications
- Microwave test equipment
- Microwave transmission devices
- Couplers, splitters, combiners, amplifiers, and antennas


Product Tags:

60mil Immersion Gold Rigid Circuits

      

TLX-8 Immersion Gold Rigid Circuits

      

Immersion Gold pcb 2 layer

      
Quality 60mil TLX-8 PCB 2 Layer Immersion Gold Rigid Circuits for sale

60mil TLX-8 PCB 2 Layer Immersion Gold Rigid Circuits Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)