Today, we're going to introduce a newly shipped PCB based on DiClad 870 laminates.
Introduction of DiClad 870:
Rogers DiClad 870 laminates are woven fiberglass reinforced, PTFE-based composites that offer lower dielectric constant for use as printed circuit board substrates. By using fewer plies of woven fiberglass and a higher ratio of PTFE content, the DiClad 870 laminates offer lower dielectric constants (Dk) and dissipation factors at a similar thickness to other laminates in the DiClad series. The woven fiberglass reinforcement in DiClad 870 provides greater dimensional stability than nonwoven fiberglass reinforced PTFE based laminates of similar dielectric constants. The coated fiberglass plies in DiClad 870 materials are aligned in the same direction.
Features:
Dielectric constant (Dk) of 2.33 at 10 GHz and 1 MHz, 50% RH
Dissipation factor of 0.0013 at 10 GHz, 0.0009 at 1MHz, 50% RH
Moisture Absorption 0.02%
CTE in X-axis of 17 ppm/°C, Y-axis of 29ppm/°C and Z-axix of 217ppm/°C
Copper Peel Strength of 14 lbs/in
UL 94-V0 Flammability
NASA outgassing: Total mass loss of 0.01%, Collected Volatiles of 0.01%, Water vapor recovered of 0.01%
| Property | DiClad 870 | Condition | Test Method |
| Electrical Properties |
| Dielectric Constant @ 10 GHz | 2.33 | C23/50 | IPC TM-650 2.5.5.5 |
| Dielectric Constant @ 1 MHz | 2.33 | C23/50 | IPC TM-650 2.5.5.3 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 1 MHz | 0.0009 | C23/50 | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Er (ppm/°C) | -161 | -10°C to +140°C | IPC TM-650 2.5.5.5
Adapted |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 3.4 x 10 7 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance | >180 | D48/50 | ASTM D-495 |
| Dielectric Breakdown (kV) | >45 | D48/50 | ASTM D-149 |
| Mechanical Properties |
| Peel Strength (lbs.per inch) | 14 | After Thermal Stress | IPC TM-650 2.4.8 |
| Tensile Modulus (kpsi) | 485(MD), 346(CD) | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 14.9(MD), 11.2 (CD) | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 327 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 437 | A, 23°C | ASTM D-790 |
| Thermal Properties |
| Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis | 17 29 217 | 0°C to 100°C | IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer |
| Thermal Conductivity (W/mK) | 0.257 | 100°C | ASTM E-1225 |
| Flammability UL | Meets requirements of UL94-V0 | C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
| Physical Properties |
| Density (g/cm3) | 2.26 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.02 | E1/105 + D24/23 | MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2 |
| Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | 0.02 0.00 0.01 NO | 125°C, ≤ 10-6 torr | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% |
Benefits:
Extremely Low Loss Tangent
Excellent Dimensional Stability
Product Performance Uniformity
Electrical Properties are Highly Uniform Across Frequency
Consistent Mechanical Performance
Excellent Chemical Resistance
Lowest moisture absorption among PTFE based composites
Stable Dk over a wide frequency range
Low Dk supports wider line widths for lower insertion loss
PCB Stackup:
The PCB stackup for the DiClad 870 laminate is a 2-layer rigid design. It consists of 35 μm copper layers on the top and bottom, with a 0.127 mm (5 mil) thick DiClad 870 dielectric layer in between.
PCB Construction Details:
The board dimensions are 63.44 mm x 49.5 mm, with a tolerance of ±0.15 mm. The minimum trace/space requirement is 4/5 mils, and the minimum hole size is 0.20 mm. There are no blind vias used in the design. The finished board thickness is 0.2 mm, and the copper weight on the outer layers is 1 oz (1.4 mils). The via plating thickness is 20 μm, and the surface finish is ENIG. No silkscreen or solder mask is used on the board.
| PCB material: | Woven Fiberglass reinforced PTFE Laminates |
| Designation: | DiClad 870 |
| Dielectric constant: | 2.3 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold plated etc.. |
PCB Statistics:
This PCB has a total of 4 components. There are 8 total pads, with 5 being through-hole and 3 being top-side SMT. It also includes 10 vias and 1 net.
Artwork Supplied: The artwork for this PCB is provided in Gerber RS-274-X format.
Accepted Standard: The PCB is manufactured to the IPC-Class-2 standard.
Availability: This PCB is available worldwide.
Typical Applications:
Radar feed networks
Commercial phased array networks
Low-loss base station antennas
Guidance systems
Digital radio antennas
Filters, couplers, LNAs
Product Tags:
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2 Layer DiClad 870 RF PCB 5mil 0.2mm ENIG No Soldermask Images
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