The RT/duroid 5880 and RO4003C hybrid PCB combines the strengths of two exceptional materials to deliver unparalleled electrical performance and reliable thermal management. With the RT/duroid 5880's low loss properties and stable dielectric constant (Dk), paired with the low loss and excellent electrical characteristics of RO4003C, this hybrid PCB offers enhanced functionality and design flexibility for a wide range of high-frequency applications.
Key Features of RT/duroid 5880:
Dk of 2.20 +/- .02: The RT/duroid 5880 maintains a consistent dielectric constant across a wide frequency range, ensuring reliable signal transmission and minimal signal loss.
Dissipation factor of .0009 at 10GHz: With an impressively low dissipation factor, the RT/duroid 5880 minimizes energy loss, maximizing signal integrity and efficiency.
Low moisture absorption: The RT/duroid 5880 exhibits low moisture absorption, making it suitable for applications in humid environments while maintaining stable electrical performance.
Isotropic: The isotropic nature of RT/duroid 5880 ensures uniform electrical properties in all directions, simplifying the design process and enabling consistent performance.
| RT/duroid 5880 Typical Value |
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.20
2.20±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0004
0.0009 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X |
| 860(125) | 380(55) | Y |
| Ultimate Stress | 29(4.2) | 20(2.9) | X |
| 27(3.9) | 18(2.6) | Y |
| Ultimate Strain | 6 | 7.2 | X | % |
| 4.9 | 5.8 | Y |
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y |
| 940(136) | 670(97) | Z |
| Ultimate Stress | 27(3.9) | 22(3.2) | X |
| 29(5.3) | 21(3.1) | Y |
| 52(7.5) | 43(6.3) | Z |
| Ultimate Strain | 8.5 | 8.4 | X | % |
| 7.7 | 7.8 | Y |
| 12.5 | 17.6 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 31
48
237 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
Key Features of RO4003C:
Dk of 3.38 +/- 0.05: The RO4003C offers a controlled dielectric constant, providing stability and predictability in high-frequency applications.
Dissipation factor of 0.0027 at 10 GHz: With low loss characteristics, the RO4003C minimizes signal attenuation and ensures efficient signal transmission.
Low Z-axis coefficient of thermal expansion (CTE) at 46 ppm/°C: The RO4003C's low CTE helps mitigate issues related to thermal expansion, ensuring reliable performance in varying temperature conditions.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Benefits of the RT/duroid 5880 and RO4003C Hybrid:
Enhanced electrical performance: By combining the unique properties of RT/duroid 5880 and RO4003C, this hybrid PCB optimizes electrical performance, ensuring reliable signal integrity, minimal loss, and consistent high-frequency operation.
Improved thermal management: The high thermal conductivity of RO4003C helps dissipate heat effectively, preventing overheating issues in areas prone to heat generation. Incorporating RO4003C layers in strategic locations enhances thermal management capabilities.
Design flexibility: The hybrid design allows for greater flexibility in PCB layout and design. Engineers can selectively use either RT/duroid 5880 or RO4003C in different areas of the board to achieve desired electrical and thermal characteristics, optimizing functionality and meeting specific design requirements.
Cost-effectiveness: By utilizing a hybrid approach, engineers can achieve cost benefits compared to using a single material throughout the board. Selecting the most suitable material for specific regions based on performance requirements optimizes costs while maintaining functionality.
Wide frequency range: The combination of RT/duroid 5880 and RO4003C expands the utility of the hybrid PCB across a wide frequency range, making it suitable for various high-frequency and broadband applications, including automotive radar, commercial airline broadband antennas, microstrip and stripline circuits, millimeter-wave applications, and point-to-point digital radio antennas.
Reliability and durability: Both RT/duroid 5880 and RO4003C are known for their high-quality construction and reliability. When combined in a hybrid PCB, they contribute to the overall durability and long-term performance of the board, ensuring robustness and stability in demanding applications.
PCB Stackup and Construction Details:
This 4-layer rigid PCB features a stackup with RT/duroid 5880 and RO4003C cores, along with prepreg layers. The board dimensions are 109mm x 71.57mm, with a finished thickness of 1.3mm. The PCB adheres to strict manufacturing standards, including a minimum trace/space of 4/4 mils, a minimum hole size of 0.3mm, and a 100% electrical test prior to shipment. The surface finish is Immersion Gold, and the top layer has a white silkscreen.
PCB Statistics and Artwork:
This PCB contains 68 components, 117 total pads (72 through-hole, 45 top-side SMT), 87 vias, and 5 nets. The artwork is provided in Gerber RS-274-X format, and this PCB is manufactured to the IPC-Class-2 quality standard.
This hybrid PCB is available worldwide.
Applications:
This hybrid PCB is ideal for a wide range of applications, including:
Automotive radar and sensors
Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter-wave applications
Point-to-point digital radio antennas
With its exceptional electrical performance, thermal management capabilities, and design flexibility, this hybrid PCB is the perfect choice for engineers seeking a reliable and cost-effective solution for their high-frequency and broadband projects.
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Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold Images
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