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10mil RF-35 Immersion Gold PCB 2-layer Rigid Circuit Black Silkscreen

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10mil RF-35 Immersion Gold PCB 2-layer Rigid Circuit Black Silkscreen

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Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : RF-35

PCB size : 65.9mm x 36.32 mm=1PCS, +/- 0.15mm

Copper weight : 1oz (1.4 mils) outer layers

Surface finish : Immersion Gold

Layer count : 2-layer

PCB Thickness : 10mil

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Introducing the newly shipped PCB based on RF-35.

RF-35, a cutting-edge organic-ceramic laminate in Taconic's renowned ORCER product family, brings together the expertise of ceramic fill technology and coated PTFE fiberglass. With its woven glass reinforcement, RF-35 emerges as the ultimate choice for cost-effective, high-volume commercial microwave and radio frequency applications. It surpasses standard epoxy materials in critical aspects such as exceptional peel strength for 1/2 ounce and 1 ounce copper, making it ideal for situations requiring rework. Moreover, its ultra-low moisture absorption rate and low dissipation factor minimize phase shift with frequency, ensuring optimal performance.

Key Features:
- Dielectric Constant at 1.9GHz: 3.5
- Dissipation Factor at 1.9GHz: 0.0018
- Dielectric Breakdown: 41 kV
- X CTE: 19 ppm/°C
- Y CTE: 24 ppm/°C
- Z CTE: 64 ppm/°C
- Flammability: UL-94 V0

Benefits:
- Low Cost: Cost-effective solution for high-volume production
- Excellent Peel Strength: Ensures robust adhesion, facilitating rework
- Exceptionally Low Dissipation Factor: Minimizes phase shift for reliable performance
- Low Moisture Absorption: Maintains stability and performance under varying conditions
- Enhanced Surface Smoothness: Enables precise trace and component placement

Property Test Method Unit Value Unit Value
Dielectric Constant @ 1.9 GHz IPC-TM 650 2.5.5 3.5 3.5
Dissipation Factor @ 1.9 GHz IPC-TM 650 2.5.5 0.0018 0.0018
Moisture Absorption (.060") IPC-TM 650 2.6.2.1 % 0.02 % 0.02
Peel Strength (1/2 oz. copper) IPC-TM 650 2.4.8 lbs./linear inch >8.0 N/mm >1.5
Peel Strength (1 oz. copper) IPC-TM 650 2.4.8 lbs./linear inch >10.0 N/mm >1.8
Dielectric Breakdown IPC-TM 650 2.5.6 kV 41 kV 41
Volume Resistivity IPC-TM 650 2.5.17.1 Mohm/cm 1.26 x 109 Mohm/cm 1.26 x 109
Surface Resistivity IPC-TM 650 2.5.17.1 Mohm 1.46 x 108 Mohm 1.46 x 108
Arc Resistance IPC TM 650 2.5.1 seconds >180 seconds >180
Flexural Strength Lengthwise ASTM D 790 psi >22,000 N/mm2 >152
Flexural Strength Crosswise ASTM D 790 psi >18,000 N/mm2 >124
Thermal Conductivity ASTM F 433 W/m/K 0.24 W/m/K 0.24
Tensile Strength Lengthwise ASTM D 638 psi 27,000 N/mm2 187
Tensile Strength Crosswise ASTM D 638 psi 21,000 N/mm2 145
Dimensional Stability Lengthwise IPC-TM 650 2.4.39 in/in 0.00004 mm/mm 0.00004
Dimensional Stability Crosswise IPC-TM 650 2.4.39 in/in -0.0001 mm/mm -0.0001
x-y CTE ASTM D 3386 (TMA) ppm/°C 19-24 ppm/°C 19-24
z CTE ASTM D 3386 (TMA) ppm/°C 64 ppm/°C 64
Flammability UL-94 V-0 V-0
Hardness Rockwell M Scale 34 34

The RF-35 PCB is a 2-layer rigid PCB with copper layers of 35 μm thickness. The RF-35 core has a thickness of 10mil (0.254 mm). The board dimensions are 65.9mm x 36.32 mm (1PCS), with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4mm. The finished board thickness is 0.3mm, with 1oz (1.4 mils) outer layers of copper weight. The via plating thickness is 25 μm, and the surface finish is immersion gold. The top silkscreen is black, while there is no silkscreen on the bottom. Solder masks are not applicable for both the top and bottom layers. Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and reliability.

The RF-35 PCB statistics showcase its versatility. It supports 18 components and offers a total of 26 pads, including 19 thru-hole pads, 7 top SMT pads, and 0 bottom SMT pads. The PCB features 11 vias and 2 nets.

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35
Dielectric constant: 3.5
Dissipation Factor 0.0018
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

10mil RF-35 Immersion Gold PCB 2-layer Rigid Circuit Black Silkscreen

The artwork supplied for RF-35 is in the Gerber RS-274-X format, meeting industry standards. The quality standard for the PCB production is IPC-Class-2, ensuring consistency and reliability. RF-35 PCBs are available worldwide, catering to diverse application needs.

RF-35 finds wide application across various industries. It is an excellent choice for power amplifiers, filters, couplers, and passive components.

Discover the superior performance and affordability of RF-35, the perfect companion for your commercial microwave and RF projects. Experience reliable results and unleash your creativity with RF-35 PCBs.


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