Introducing our newly shipped RO3206 High-Frequency PCB, designed to deliver exceptional electrical performance and mechanical stability at competitive prices. This 2-layer rigid PCB is constructed using Rogers' RO3206 high-frequency circuit materials, known for their superior characteristics and reliability. With a range of features and benefits, this PCB is suitable for a variety of applications requiring high-frequency performance and dimensional stability.
RO3206 High-Frequency Circuit Materials:
RO3206 materials are ceramic-filled laminates reinforced with woven fiberglass, engineered to provide excellent electrical performance and improved mechanical stability. Key features include:
- Dielectric Constant and Tolerance: RO3206 offers a dielectric constant of 6.15 with a tight tolerance of 0.15 at 10 GHz and 23°C, ensuring precise signal transmission.
- Dissipation Factor: With a dissipation factor of 0.0027 at 10 GHz, RO3206 minimizes signal loss and enables high-frequency performance.
- High Thermal Conductivity: RO3206 exhibits high thermal conductivity of 0.67 W/MK, facilitating efficient heat dissipation in demanding applications.
- Low Moisture Absorption: With moisture absorption less than 0.1%, RO3206 maintains excellent performance even in humid environments.
- Matched Copper CTE: The material is matched to copper's coefficient of thermal expansion (CTE) in the X-axis (13 ppm/°C), Y-axis (13 ppm/°C), and Z-axis (34 ppm/°C), ensuring dimensional stability and reliability.
- Strong Copper Peel Strength: RO3206 demonstrates a robust copper peel strength of 10.7 lbs/in, ensuring reliable interconnectivity.
| Property | RO3206 | Direction | Unit | Condtion | Test Method |
| Dielectric Constant, εr Process | 6.15± 0.15 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, εr Design | 6.6 | Z | - | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor, tan δ | 0.0027 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -212 | Z | ppm/°C | 10 GHz 0-100°C | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X,Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | | MΩ•cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 103 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 462
462 | MD
CMD | kpsi | 23°C | ASTM D638 |
| Water Absorption | <0.1 | - | % | D24/23 | IPC-TM-650
2.6.2.1 |
| Specific Heat | 0.85 | | J/g/K | | Calculated |
| Thermal Conductivity | 0.67 | - | W/m/K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion (-55 to 288 °C) | 13
34 | X,Y,
Z | ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | °C | TGA | ASTM D3850 |
| Color | Tan | | | | |
| Density | 2.7 | | gm/cm3 | | |
| Copper Peel Strength | 10.7 | | pli | 1 oz. EDC After Solder Float | IPC-TM-2.4.8 |
| Flammability | V-0 | | | | UL 94 |
Lead Free Process
Compatible | YES | | | | |
Benefits of RO3206 High-Frequency PCB:
1. Woven Glass Reinforcement: The woven glass reinforcement enhances rigidity, making the PCB easier to handle during assembly and installation.
2. Uniform Electrical and Mechanical Performance: The PCB delivers consistent electrical and mechanical performance, making it ideal for complex multi-layer high-frequency structures.
3. Low Dielectric Loss: RO3206's low dielectric loss contributes to excellent high-frequency performance, enabling reliable signal transmission.
4. Low In-Plane Expansion Coefficient: The PCB's low in-plane expansion coefficient, matched to copper, makes it suitable for use in epoxy multilayer board hybrid designs and ensures reliable surface-mounted assemblies.
5. Excellent Dimensional Stability: RO3206 offers excellent dimensional stability, leading to high production yields and reliable performance in various operating conditions.
6. Cost-Effective: The PCB is economically priced, making it a cost-effective choice for volume manufacturing.
7. Surface Smoothness: The PCB's surface smoothness allows for finer line etching tolerances, enabling precise circuit designs.
| PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: | RO3206 |
| Dielectric constant: | 6.15 |
| Dissipation factor | 0.0027 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 25mil (0.635mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
PCB Specifications and Construction:
- Board Dimensions: The PCB dimensions are precisely maintained at 51.91mm x 110mm (1PCS) with a tolerance of +/- 0.15mm.
- Trace/Space and Hole Size: The minimum trace/space is 4/6 mils, allowing for fine routing. The minimum hole size is 0.35mm to accommodate various component requirements.
- PCB Stackup: The PCB features a 2-layer rigid construction with copper_layer_1 (35 μm), RO3206 core (0.635 mm or 25mil), and copper_layer_2 (35 μm).
- Finished Board Thickness and Copper Weight: The finished board thickness is 0.8mm, providing a compact and reliable solution. Each outer layer has a copper weight of 1oz (1.4 mils), ensuring efficient conductivity.
- Via Plating and Surface Finish: The via plating thickness is 20 μm, ensuring reliable interconnectivity. The surface finish is ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), providing excellent solderability and corrosion resistance.
- Silkscreen and Solder Mask: The top silkscreen is in black, enhancing component visibility. There is no bottom silkscreen. The top and bottom solder masks are not applied.
- Electrical Testing and Quality Standard: Each PCB undergoes a comprehensive 100% electrical test to guarantee optimal functionality. The product complies with the IPC-Class-2 quality standard, ensuring reliability and consistent performance.
Artwork, Availability, and Applications:
It is compatible with Gerber RS-274-X artwork, facilitating seamless integration into your design workflow. It is readily available worldwide, providing easy accessibility to designers and manufacturers seeking high-performance PCB solutions.
This PCB is suitable for a wide range of applications, including automotive collision avoidance systems, GPS antennas, wireless telecommunications systems, microstrip patch antennas, direct broadcast satellites, remote meter readers, power backplanes, LMDS and wireless broadband, and base station infrastructure.
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25mil RO3206 PCB 2 Layer ENEPIG Rigid Circuit Boards Images
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