Introducing a newly shipped PCB which is crafted with Rogers AD250C commercial microwave and RF laminate material. This 2-layer rigid PCB combines advanced composite chemistry and construction techniques to deliver unparalleled price-performance for today's telecommunication infrastructure.
Key Features:
Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates: The AD250 PCB utilizes high-quality laminates that provide exceptional mechanical strength and resilience.
Controlled Dielectric Constant: With a low and tightly controlled dielectric constant of 2.50, the AD250 PCB ensures optimal signal integrity and efficient transmission across a wide range of frequencies.
Low Loss Tangent: The AD250 PCB boasts an impressively low loss tangent (<0.002 at 10 GHz), enabling outstanding circuit performance in all typical wireless frequency bands.
Excellent Dimensional Stability: The AD250 PCB offers excellent dimensional stability, leading to repeatable circuit performance and improved manufacturing yields. It also enhances plated through-hole (PTH) reliability compared to typical PTFE-based laminates.
Very Low PIM: With an outstanding PIM rating of -159 dBc at 30 mil and 1900 MHz, the AD250 PCB ensures excellent antenna performance and minimizes yield loss associated with PIM-related issues.
Controlled Dielectric Constant (±0.05): The AD250 PCB provides a controlled dielectric constant, guaranteeing repeatable circuit performance and a higher degree of stability during temperature changes.
| Property | Test Method | Unit | TSM-DS3 | Unit | TSM-DS3 |
| Dk | IPC-650 2.5.5.3 | | 3.00 | | 3.00 |
| TcK (-30 to 120 °C) | IPC-650 2.5.5.5.1 (Modified) | ppm | 5.4 | ppm | 5.4 |
| Df | IPC-650 2.5.5.5.1 (Modified) | | 0.0011 | | 0.0011 |
| Dielectric Breakdown | IPC-650 2.5.6 (ASTM D 149) | kV | 47.5 | kV | 47.5 |
| Dielectric Strength | ASTM D 149 (Through Plane) | V/mil | 548 | V/mm | 21,575 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 226 | Seconds | 226 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.07 | % | 0.07 |
| Flexural Strength (MD) | ASTM D 790/ IPC-650 2.4.4 | psi | 11,811 | N/mm2 | 81 |
| Flexural Strength (CD) | ASTM D 790/ IPC-650 2.4.4 | psi | 7,512 | N/mm2 | 51 |
| Tensile Strength (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 7,030 | N/mm2 | 48 |
| Tensile Strength (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 3,830 | N/mm2 | 26 |
| Elongation at Break (MD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.6 | % | 1.6 |
| Elongation at Break (CD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.5 | % | 1.5 |
| Young’s Modulus (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 973,000 | N/mm2 | 6,708 |
| Young’s Modulus (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 984,000 | N/mm2 | 6,784 |
| Poisson’s Ratio (MD) | ASTM D 3039/IPC-650 2.4.19 | | 0.24 | | 0.24 |
| Poisson’s Ratio (CD) | ASTM D 3039/IPC-650 2.4.19 | | 0.20 | | 0.20 |
| Compressive Modulus | ASTM D 695 (23.C) | psi | 310,000 | N/mm2 | 2,137 |
| Flexural Modulus (MD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,860 | N/mm2 | 12,824 |
| Flexural Modulus (CD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,740 | N/mm2 | 11,996 |
| Peel Strength (CV1) | IPC-650 2.4.8 Sec 5.2.2 (TS) | lbs/in | 8 | N/mm | 1.46 |
| Thermal Conductivity (unclad) | ASTM F 433/ASTM 1530-06 | W/M*K | 0.65 | W/M*K | 0.65 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.21 | mm/M | 0.21 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.20 | mm/M | 0.20 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.15 | mm/M | 0.15 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.10 | mm/M | 0.10 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms | 2.3 x 10^6 | Mohms | 2.3 x 10^6 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms | 2.1 x 10^7 | Mohms | 2.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms/cm | 1.1 x 10^7 | Mohms/cm | 1.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms/cm | 1.8 x 10^8 | Mohms/cm | 1.8 x 10^8 |
| CTE (x axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 10 | ppm/ºC | 10 |
| CTE (y axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 16 | ppm/ºC | 16 |
| CTE (z axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 23 | ppm/ºC | 23 |
| Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.11 | g/cm3 | 2.11 |
| Hardness | ASTM D 2240 (Shore D) | | 79 | | 79 |
| Td (2% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 526 | ºC | 526 |
| Td (5% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 551 | ºC | 551 |
Benefits:
Unmatched Circuit Performance: The AD250 PCB ensures excellent circuit performance in all typical wireless frequency bands, guaranteeing seamless communication and optimal signal transmission.
Enhanced Antenna Efficiencies: With its low loss tangent and controlled dielectric constant, the AD250 PCB maximizes antenna efficiencies, resulting in improved signal reception and transmission capabilities.
Reliable Dk Stability: The AD250 PCB's ceramic construction provides a higher degree of dielectric constant stability during temperature changes, ensuring consistent circuit performance in varying environmental conditions.
| PCB Material: | Ceramic-filled Woven Fiberglass PTFE Laminates |
| Designation: | TSM-DS3 |
| Dielectric constant: | 3 +/-0.05 |
| Dissipation factor | 0.0011 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
This PCB is a 2-layer rigid printed circuit board with a well-optimized stackup for excellent performance. The stackup consists of a copper layer on the top side, measuring 35 μm in thickness, followed by the TSM-DS3 core layer, which is 0.127 mm (5mil) thick, and finally, another copper layer on the bottom side, also measuring 35 μm. This stackup ensures reliable signal transmission and efficient thermal management.
When it comes to construction details, this PCB offers precise specifications to meet your requirements. The board dimensions are 82mm x 82mm, allowing for a single PCB in each order, with a tight tolerance of +/- 0.15mm. The minimum trace/space is set at 4/7 mils, enabling intricate circuit designs. The minimum hole size is 0.4mm, providing flexibility for component mounting.
This PCB has a finished board thickness of 0.2mm, contributing to its compact form factor. The finished copper weight on the outer layers is 1oz (1.4 mils), ensuring robust conductivity and durability. Via plating thickness is 20 μm, promoting reliable interconnection between layers. The surface finish is achieved with immersion silver, which enhances solderability and corrosion resistance.
In terms of aesthetics, this PCB doesn't feature a top or bottom silkscreen, giving it a clean and minimalistic appearance. It also lacks a top and bottom solder mask, allowing for direct visual inspection of the copper traces. Before shipment, each PCB undergoes a thorough 100% electrical test to ensure it meets the required specifications and quality standards.
It supports a total of 36 components, with 163 pads available for seamless component integration. This PCB incorporates 132 thru-hole pads and 31 top surface mount technology (SMT) pads. There are no bottom SMT pads. With 151 vias and 2 nets, the PCB facilitates efficient signal routing and connectivity.
Type of artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: worldwide
Some Typical Applications:
Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antenna/Automotive
Oil Drilling
Semiconductor/ATE Testing
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5mil TSM-DS3 PCB Double Sided Boards Immersion Silver Images
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