The Rogers RO4003C PCB is an innovative solution that combines the superior electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This versatile laminate is designed for applications requiring exceptional reliability, making it a game-changer in the RF and microwave sectors.
Key Features of Rogers RO4003C
Superior Electrical Performance
One of the standout features of the Rogers RO4003C is its dielectric constant (Dk), which is measured at 3.38 ± 0.05 at 10 GHz. This tight control over the dielectric constant is crucial for maintaining signal integrity in high-frequency applications. Alongside this, the PCB boasts a dissipation factor of 0.0027 at 10 GHz, ensuring minimal signal loss and optimal performance.
Thermal Stability
The RO4003C excels in thermal performance, with a thermal decomposition temperature (Tg) exceeding 280°C (536°F). This stability allows the material to maintain its properties over a wide range of processing temperatures, making it ideal for demanding environments. The thermal coefficient of the dielectric constant of +40 ppm/°C indicates that the material can maintain its electrical performance even under thermal stress.
Coefficient of Thermal Expansion (CTE)
One of the critical advantages of the Rogers RO4003C is its CTE, which is closely aligned with that of copper. This similarity allows for excellent dimensional stability, particularly important in multilayer boards that incorporate mixed dielectric materials. The low Z-axis CTE of 46 ppm/°C ensures reliable plated through-hole quality, even under severe thermal conditions.
Moisture Resistance
With a low moisture absorption rate of 0.06%, the Rogers RO4003C is designed to perform well in various environmental conditions. This feature is particularly beneficial for applications in humid or variable temperature settings, providing engineers with peace of mind regarding the durability and reliability of their designs.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Layer Stackup
This PCB is configured as a 2-layer rigid PCB, featuring:
- Copper Layer 1: 35 μm
- Rogers 4003C Core: 0.203 mm (8 mil)
- Copper Layer 2: 35 μm
Detailed Construction
The dimensions of this board are 117.04 mm x 67.11 mm (1 piece, ± 0.15 mm), with a minimum trace/space specification of 4/4 mils and a minimum hole size of 0.3 mm. The finished board thickness is 0.3 mm, and the copper weight on the outer layers is set at 1 oz (1.4 mils).
Additional Specifications
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion silver
- Top Silkscreen: Black
- Bottom Silkscreen: None
- Top Solder Mask: None
- Bottom Solder Mask: None
- Electrical Testing: 100% electrical test performed prior to shipment
Advantages of Rogers RO4003C
Cost-Effective Processing
The Rogers RO4003C is designed to be processed like standard epoxy/glass materials, offering lower manufacturing costs compared to conventional microwave laminates. This cost-effectiveness makes it an attractive choice for high-volume applications without sacrificing quality or performance.
Ideal for Multi-Layer Board Constructions
The unique properties of the RO4003C make it particularly well-suited for multi-layer board (MLB) constructions. Its dimensional stability and low moisture absorption help ensure that the boards remain reliable and functional over time, even in challenging environments.
Typical Applications
The versatility of the Rogers RO4003C PCB allows it to be utilized in a wide array of applications, including:
- Cellular Base Station Antennas and Power Amplifiers: Enhancing connectivity and signal quality in telecommunications.
- RF Identification Tags: Supporting efficient tracking and identification in various settings.
- Automotive Radar and Sensors: Improving safety and navigation systems in vehicles, crucial for advanced driver-assistance systems (ADAS).
- LNBs for Direct Broadcast Satellites: Ensuring high-quality signal reception for satellite communications.
Conclusion
The Rogers RO4003C PCB represents a significant advancement in PCB technology, offering a perfect blend of performance, reliability, and cost-effectiveness. With its exceptional electrical properties, thermal stability, and moisture resistance, it is poised to meet the demands of modern electronics applications. Whether you're in telecommunications, automotive, or satellite communications, the Rogers RO4003C PCB is an indispensable component for engineers and designers looking to push the boundaries of innovation. Embrace the future of PCB design with Rogers RO4003C and elevate your projects to new heights.
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