Introduction to RT/Duroid 6035HTC
Rogers RT/Duroid 6035HTC is a high-frequency circuit material that combines ceramic-filled PTFE composites, making it an exceptional choice for high-power RF and microwave applications. This laminate boasts thermal conductivity nearly 2.4 times that of standard RT/Duroid 6000 products, ensuring excellent long-term thermal stability when paired with copper foil (both ED and reverse-treated). Furthermore, Rogers’ advanced filler system enhances drillability, significantly reducing drilling costs compared to traditional high thermally conductive laminates that utilize alumina fillers.
Key Features
Dielectric Constant (DK): 3.5 ± 0.05 at 10 GHz/23°C.
Dissipation Factor: 0.0013 at 10 GHz/23°C.
Thermal Coefficient of Dielectric Constant: -66 ppm/°C.
Moisture Absorption: 0.06%.
Thermal Conductivity: 1.44 W/m/K at 80°C.
Coefficient of Thermal Expansion (CTE): 19 ppm/°C in both X and Y axes, 39 ppm/°C in the Z-axis.
These characteristics ensure that RT/Duroid 6035HTC PCB meets the rigorous demands of modern electronics, providing a stable platform for high-frequency applications.
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.6 | Z | | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor | 0.0013 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | | MΩ.cm | A | IPC-TM-650, 2.5.17.1 |
| Surface Resistivity | 108 | | MΩ | A | IPC-TM-650, 2.5.17.1 |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | | W/m/k | 80℃ | ASTM C518 |
| Density | 2.2 | | gm/cm3 | 23℃ | ASTM D792 |
| Copper Peel Stength | 7.9 | | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-Free Process Compatible | Yes | | | | |
Why Choose RT/Duroid 6035HTC?
Outstanding Thermal Management: The high thermal conductivity allows for superior heat dissipation, resulting in cooler operating temperatures for high-power applications. This translates to enhanced reliability and longevity for electronic components.
Impressive Dielectric Performance: With a low dissipation factor, RT/Duroid 6035HTC minimizes insertion loss, ensuring that signals remain strong and clear even at elevated frequencies.
Long-lasting Stability: The combination of excellent thermal and electrical properties guarantees that this PCB maintains its performance over time, even under demanding conditions.
PCB Construction details
This 2-layer rigid PCB featuring a specific stackup: Copper Layer 1 at 35 μm, an RT/Duroid 6035HTC core of 0.254 mm (10 mil), and Copper Layer 2 also at 35 μm. Detailed construction specifications include board dimensions of 54 mm x 76 mm (± 0.15 mm), a minimum trace/space of 4/4 mils, and a minimum hole size of 0.2 mm. The finished board thickness is 0.3 mm, with a finished copper weight of 1 oz (1.4 mils) for outer layers. The PCB is also rigorously tested, with 100% electrical testing conducted prior to shipment.
Artwork and Standards
This PCB is supplied with Gerber RS-274-X artwork and complies with IPC-Class-2 standards, ensuring high quality and reliability throughout the production process.
Global Availability
The RT/Duroid 6035HTC PCB is available worldwide, making it accessible to engineers and manufacturers across various sectors, enhancing their design capabilities.
| PCB Material: | Ceramic-filled PTFE composites |
| Designation: | RT/duroid 6035HTC |
| Dielectric constant: | 3.50±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Typical Applications
The versatility and reliability of RT/Duroid 6035HTC make it ideal for a range of applications, including:
High-Power RF and Microwave Amplifiers: Essential for effective signal amplification in communication systems.
Power Amplifiers and Couplers: Providing stable performance in demanding RF environments.
Filters and Combiners: Enabling effective signal management in complex circuits.
Power Dividers: Facilitating reliable signal distribution in RF applications.
Conclusion
The RT/Duroid 6035HTC PCB is a transformative solution for high-frequency and high-power applications. As the electronics industry continues to evolve, RT/Duroid 6035HTC is positioned to meet the challenges of tomorrow's high-power applications, ensuring that your designs are both reliable and efficient.
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